Samsung Electronics is about to take the semiconductor industry to another level. It announced today that following the qualification of 8-nanometer (nm) FinFET process technology, and 8LPP (Low Power Plus), it is ready to go into production. This technology is more efficient than what we currently have and it will deliver a 10% area reduction relative to the 10LPP through a narrower metal pitch. Expectations are high because 8LPP is considered to be the most advanced process node worldwide thus it is anticipated to run high-performance applications better. Relative to the 10LPP, 8LPP will also provide a 10% lower power consumption and it will efficiently segregate the advantages for apps including mobile, cryptocurrency and network/server
Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics said
“With the qualification completed three months ahead of schedule, we have commenced 8LPP production,”…“Samsung Foundry continues to expand its process portfolio in order to provide distinct competitive advantages and excellent manufacturability based on what our customers and the market require.”
The Senior Vice President of Qualcomm, RK Chunduru, has this to say about 8LPP
“8LPP will have a fast ramp since it uses proven 10nm process technology while providing better performance and scalability than current 10nm-based products,”
At the Samsung Foundry Forum (SFF) which took place yesterday in Munich, Germany, details of the 8LPP technology, FD-SOI technology, security solutions, Samsung’s foundry business roadmap amongst other things were presented. This Forum has already been hosted in the United States, South Korea, and Japan earlier this year and the South Korean manufacturing giant has stated that it will be hosting this event (SFF) at various regions throughout the globe.
